LEAD FRAME

Precision Stamping Dies and Stamping for Lead Frames

Fine leads, flat and burr-free.

A lead frame supports the semiconductor chip and connects it electrically to the outside world. As packages shrink and pin counts rise, leads get narrower and closer together, and blanking burrs, lead twist and flatness increasingly determine yield in downstream wire bonding and molding.

With progressive dies finished on high-accuracy plates and precision high-speed automatic presses, we build dies for and stamp thin-gauge lead frames. We also supply individual die components and plates.

PITCH ACCURACY
±2µm
Die plate pitch accuracy
SURFACE ROUGHNESS
Ra0.04µm+
Wire EDM surface finish
THIN SHEET
0.1mm or less
Extensive thin-sheet experience
MIN. PITCH
0.35mm
Fine-pitch track record

What the industry requires, and how we respond

Item What the industry requires Our response
Fine-lead blanking Stable blanking of narrow lead spacing and fine lead widths ±2 µm pitch-accuracy plates and rigid, concentric mounting of fine carbide punches keep fine blanked features stable.
Burr control Limiting burr height that affects bonding and molding Plate accuracy reproduces design clearances exactly, preventing burrs caused by uneven cutting clearance.
Flatness & twist Preventing lead lift, twist and warpage Strip hold-down by the stripper and the station layout are worked out at the die design stage to secure flatness.
Materials Lead frame materials such as copper alloys and iron-nickel alloy (Alloy 42) Copper, copper alloys, nickel alloys and more. Please ask about pre-plated strip.
High-speed production Stable continuous production at high SPM High-SPM die design and slug-pulling prevention keep production running even at high speed.
Measuring fine dimensions Checking fine lead widths and spacing, burrs and blanked edges Image dimension measuring systems (KEYENCE IM-7000 and others) and a digital microscope verify fine dimensions and blanked edges.

* Figures shown are typical capability ranges and actual results. Feasibility may vary with part geometry, material and volume.

Typical products

Lead frames Lead frames for discrete semiconductors Lead frames for ICs Individual lead frame die components and plates

Customer names and part numbers are not disclosed due to confidentiality obligations.

Why customers choose us

Die accuracy starts with the plates

We run an MP2400 ultra-high-precision wire EDM in a dedicated climate-controlled room, building in-house the plate accuracy and repeatability that fine-lead dies depend on.

Plates and components, too

Besides complete dies, we supply individual die plates, stripper plates and punches, and make spare parts for customers' own dies.

Die and production in one company

When you entrust us with both the die and production, issues found in production go straight back into the die design.

Contact Us

Start with a single drawing.

We welcome early-stage inquiries, including parts other suppliers have turned down.
Our die designers will assess feasibility and get back to you.